Impedance measurement circuit and impedance measurement method thereof

ABSTRACT

An impedance measurement circuit and an operating method thereof are provided. The impedance measurement circuit includes a current source, a voltage controlled oscillator (VCO), an operation circuit, and a first delay circuit. The current source, electrically connected to a power rail, is able to sink a current from the power rail according to the delayed clock signal. The VCO is configured to generate an oscillation signal according to a power voltage on the power rail. The operation circuit is electrically connected to the VCO and is configured to receive a sampling clock signal and the oscillation signal, sense the power voltage to generate a sampled signal, and accumulate the sampled signal to generate a measurement result. The first delay circuit, electrically connected to the current source and the operation circuit, is able to receive the sampling clock signal and transmit the delayed clock signal to the current source.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of and claims thepriority benefit of a prior application Ser. No. 17/351,248, filed on2021 Jun. 18. The entirety of the above-mentioned patent application ishereby incorporated by reference herein and made a part of thisspecification.

BACKGROUND

Recently, high-performance computing (HPC) market is expected to becomemore popular and being widely used in advanced networking and serverapplications such as industrial internet of things (IIoT), andengineering applications especially for AI (artificial intelligence)related products that require high data rate, increasing bandwidth andfor lowering latency. However, as the package size is getting larger forpackages including the HPC component, communication between the dies andpower consumption of the HPC circuit has become more challenging issues.

The HPC circuits usually consume large current to perform complicatedcalculations at high speeds, possess the ability to process largedatasets, and generate huge power (or ground) bounce. To minimizedevelopment of common-mode currents within the silicon package of largecurrent consuming circuits, a stable power delivery network (PDN) isrequired. Any bounce (noise) on either the power or 0V reference groundmay cause simultaneously switching noise or signal integrity problems,as well as EMI. In addition, if power or ground bounce exceeds marginlevels, components may not function. Accordingly, to ensure a stable PDNis a critical issue.

Power impedance measurement (PIM) or power monitoring circuits arerequired to ensure a robust PDN. However, timing issues in digitalcircuits will exist when a trigger time and a sampling time are tooclose. Besides, the area overhead due to extra sensing voltagecontrolled oscillator (VCO) remained to be settled.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a timing diagram of power voltage and clock in accordance withsome embodiments of the disclosure.

FIG. 2 illustrates an exemplary equivalent circuit diagram of a powerdistribution network (PDN) profile extraction in accordance with someother embodiments of the disclosure.

FIG. 3A illustrates an exemplary equivalent circuit diagram of a methodof time-domain sensing in accordance with some other embodiments of thedisclosure.

FIG. 3B illustrates an exemplary equivalent circuit diagram of an edgesampler of FIG. 3A in accordance with some other embodiments of thedisclosure.

FIG. 3C illustrates an exemplary equivalent circuit diagram of anaccumulator in accordance with some other embodiments of the disclosure.

FIG. 3D is a timing diagram of signal sampling and triggeringillustrating the method of time-domain sensing of FIG. 3A in accordancewith some other embodiments of the disclosure.

FIG. 4 illustrates an exemplary equivalent circuit diagram of a portionof the power impedance measurement (PIM) system in accordance with someembodiments of the present disclosure.

FIG. 5A illustrates an exemplary equivalent circuit diagram of adual-mode PIM system in accordance with some embodiments of the presentdisclosure.

FIG. 5B is a timing diagram of the dual-mode PIM system of FIG. 5A inaccordance with some other embodiments of the disclosure.

FIG. 5C illustrates an exemplary equivalent circuit diagram of thedual-mode impedance measurement circuit of FIG. 5A operated in atime-domain sensing scheme in accordance with some other embodiments ofthe disclosure.

FIG. 5D illustrates an exemplary equivalent circuit diagram of thedual-mode impedance measurement circuit of FIG. 5A operated in afrequency-domain sensing scheme in accordance with some otherembodiments of the disclosure.

FIG. 6 illustrates a flow chart for an impedance measurement methodaccording to an embodiment of present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components, values, operations, materials,arrangements, or the like, are described below to simplify thedisclosure. These are, of course, merely examples and are not intendedto be limiting. Other components, values, operations, materials,arrangements, or the like, are contemplated. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

In addition, terms, such as “first”, “second”, “third”, “fourth” and thelike, may be used herein for ease of description to describe similar ordifferent element(s) or feature(s) as illustrated in the figures, andmay be used interchangeably depending on the order of the presence orthe contexts of the description.

Other features and processes may also be included. For example, testingstructures may be included to aid in the verification testing of the 3Dpackaging or 3DIC devices. The testing structures may include, forexample, test pads formed in a redistribution layer or on a substratethat allows the testing of the 3D packaging or 3DIC, the use of probesand/or probe cards, and the like. The verification testing may beperformed on intermediate structures as well as the final structure.Additionally, the structures and methods disclosed herein may be used inconjunction with testing methodologies that incorporate intermediateverification of known good dies to increase the yield and decreasecosts.

The present disclosure provides various embodiments of methods andcircuit to efficiently and accurately describe an equivalent-timesampling (ETS) of a power delivery network (hereinafter “PDN”) of an ICdesign. As mentioned above, such power supply noise largely results fromvarious voltage drops associated with respective circuit components ofthe IC design. In some embodiments, the disclosed systems and methodsmodel each of various circuits of the IC design. More specifically, thedisclosed systems and methods provide methods of time-domain sensing andfrequency-domain sensing of the power voltage. As such, the powervoltage drop associated with each circuit can be efficiently andaccurately estimated.

FIG. 1 is a timing diagram of power voltage and clock in accordance withsome embodiments of the disclosure. Referring to FIG. 1 , it is notedthat a waveform 100 is merely an example, and is not intended to limitthe present disclosure. Accordingly, it is understood that additionaloperations may be provided before, during, and after generating thewaveform 100, and that some other operations may only be brieflydescribed herein.

In presented embodiment, a power voltage VP, which may be periodic,stands for a voltage difference signal of PDN and a sampling clocksignal SCLK is a clock signal which can be used to sample the powervoltage VP. The points VS1, VS2, and VS3 on the VP waveform are a firstsampling point, a second sampling point, and a third sampling pointrespectively. Since a sampling rate of the sampling clock signal SCLK isslower than a frequency of the power voltage VP, the sampling clocksignal SCLK of lower frequency can be used to sample the power voltageVP several times to completely construct the voltage difference signalof power distribution network.

Referring to FIG. 1 , a method of equivalent-time sampling (ETS) is usedto construct an entire waveform of the power voltage VP by accumulatingthe sampling clock signal SCLK over many wave cycles. In ETS method, thepower voltage VP is sampled over a number of cycles by the samplingclock signal SCLK repetitively. Moreover, a sequential sampling methodof ETS can be used to capture an entire waveform and portions ofreal-time waveforms during multiple trigger events are acquired byintroducing a small delay amount (for example, DT1, DT2, and DT3)sequentially. Over time, these portions are assembled into a completewaveform. To be specific, while using sequential sampling method of ETS,the sampling clock signal SCLK acquires one sampled signal from eachtrigger event, with a fixed interval delay amount between eachacquisition.

In the present exemplary embodiment, the delay amount DT1 is 1 times aleast significant bit (LSB) of a digital value of a period of thesampling clock signal SCLK. Herein, the delay amount DT2 is 2 times theLSB of the digital value of the period of the sampling clock signalSCLK, the delay amount DT3 is 3 times the LSB of the digital value ofthe period of the sampling clock signal SCLK. In the present exemplaryembodiment, the delay amount DT1, DT2, and DT3 are variable values.

The sequential sampling method of ETS provides extremely high bandwidths(60 GHz and higher), higher timing resolution needed fortelecommunications and device characterization needs, and accuracy aswell, especially used for multiple-shot acquisitions and a repetitivewaveform. Over time, the instrument accumulates enough sampled signal toreconstruct the waveform. This method guarantees the sample rate of thesampling clock signal SCLK that is slower than the power voltage VP toget all the sampling points required to accurately reconstruct thewaveform.

FIG. 2 illustrates an exemplary equivalent circuit diagram of the PDNprofile extraction in accordance with some other embodiments of thedisclosure. Referring to FIG. 2 , an on-chip circuit 200 includes a PDNcircuit 201 and a PIM built-in self-test (PIM BIST) circuit 202. In someembodiments, the on-chip circuit 200 can be used for both the input andoutput (I/O) power rails.

The PDN circuit 201 is electrically connected to the PIM BIST circuit202. In the present exemplary embodiment, the PDN circuit 201 and thePIM BIST circuit 202 are shunt-connected.

Referring to FIG. 2 , the PIM BIST circuit 202 of the present embodimentincludes a probe 203, a current sink 204, and a switch 205. In someembodiments, the current sink 204 and the switch 205 areseries-connected. In some embodiments, the probe 203 is shunt connectedto one end of the switch 205 and another end of the current sink 204.

The PIM BIST circuit 202, which is used to extract the profile of thePDN circuit 201 and test whether the PDN circuit 201 is robust, hasshown great promise in testing and is frequently used for mass testing.A voltage difference V between two ends of the probe 203 is generated bya difference of the internal power source VDDS and the internal groundsource VSSS. The PDN circuit 201 is used to provide a voltage withinregulation limits and with an acceptable noise to each active device.

In detail, the PDN circuit 201 of the present embodiment includes acapacitance C1, resistors R1-R3, and inductors L1 and L2. In thisembodiment, the resistor R1 and the inductor L1 are series connected ona first power rail which is connected to an external power source VDDE.The resistor R2 and the inductor L2 are series connected on a secondpower rail which is connected to an external power source VSSE. Thecapacitor C1 is coupled between the first power rail and the secondpower rail, and the resistor R3 is coupled to the capacitor in parallel.In here, the capacitance C1, the resistors R1-R3, and the inductors L1and L2 may be parasitic components.

The PDN circuit 201 of the present embodiment delivers a power generatedby the external power source VDDE and the external ground source VSSE toall devices in an integrated circuit (hereinafter “IC”). In general,after a layout of the IC (and the PDN circuit 201) is designed, varioussubsequent testing steps are typically performed to verify the layoutdesign work. The testing tools simulate the layout design by assumingthat the PDN circuit 201 provides a constant voltage source to eachcircuit component of the IC. During real operations of the IC, each ofelements in the IC may be associated with a voltage drop between thepower rails. Such the voltage drop may be due to various parasiticcomponents in the PDN circuit 201, such as the capacitance C1, theresistors R1-R3, and the inductors L1 and L2 may be parasiticcomponents.

In some embodiments, the PDN circuit 201 of the on-chip circuit 200provides an interconnection framework in which the switch 205 is allowedto control on/off state of the current sink 204. The external powersource VDDE of the PDN circuit 201 may be bulky, thus interconnectionsare used. In some embodiments, the current I1 through components of thePDN circuit 201 creates a direct current (DC) drop and voltagefluctuations. In some embodiments, the PDN circuit 201 is used toregulate voltage for required current to be supplied over time. In someembodiments, the speed or the frequency at which the PDN circuit 201operates determines the speed or the frequency at which charge can besupplied or removed from capacitors.

In the present exemplary embodiment, the on-chip circuit 200 is used tomeasure the power impedance by extracting component profiles of the PDNcircuit 201. The current sink 204 is used to produce a step responsewhen the PDN circuit 201 is placed under a load condition. In someembodiments, the current sink 204 may include a fast current loop thatdetects a current gradually increasing and converging to a step valuethrough a power switch (e.g., the switch 205). After receiving the stepresponse, the voltage difference V can be measured by the PIM BISTcircuit 202. In light of this, a model of the PDN circuit 201 can beextracted by using the voltage difference V.

FIG. 3A illustrates an exemplary equivalent circuit diagram of animpedance measurement circuit in accordance with some other embodimentsof the disclosure. According to the embodiments of this invention, FIG.3A is the exemplary equivalent circuit diagram showing the time-domainsensing method to measure a power impedance. The impedance measurementcircuit 300 includes a current source 308, a voltage controlledoscillator (hereinafter “VCO”) 309, an operation circuit 304, and afirst delay circuit 307. In some embodiments, the operation circuit 304includes an edge sampler 305 and an accumulator 306.

Referring to FIG. 3A, the current source 308, which is electricallyconnected to power rails 301, provides a constant electric currentflowing between the power rails 301. In this embodiment, the currentsource 308 sources a current from the internal power source VDDS to theinternal power ground VSSS.

According to the embodiments of this invention, the operation circuit304 in the impedance measurement circuit 300 is electrically connectedto the VCO 309 and the first delay circuit 307. In addition, theoperation circuit 304 in the impedance measurement circuit 300 canreceive a sampling clock signal SCK and the oscillation signal S1 fromthe VCO 309. The VCO 309 is used to generate the oscillation signal S1based on a variation of a power voltage VP of the external power sourceVDDE. Further, the operation circuit 304 is used to sense the powervoltage VP of the external power source VDDE to generate a sampledsignal S2 based on the sampling clock signal SCK. The operation circuit304 is also used to accumulate the sampled signal S2 to generate ameasurement result. The operation circuit 304 may also transmit themeasurement result to peripheral circuits.

According to the embodiments of this invention, the first delay circuit307 in the impedance measurement circuit 300 is coupled to the currentsource 308 and is electrically connected to the operation circuit 304.Thus the first delay circuit 307 in the impedance measurement circuit300 can receive the sampling clock signal SCK and transmit a delayedclock signal S3 to be a trigger signal to the current source 308 basedon the sampling clock signal SCK. The current source 308 can be used tosink the electric current between the power rails 301 according to thedelayed clock signal S3. It is to be noted that, the delayed clocksignal S3 from the first delay circuit 307 may be generated based on thereceived sampling clock signal SCK. The delayed clock signal S3 isgenerated based on the sampling clock signal SCK. In some embodiments,the sampling clock signal SCK can be generated from any internal orexternal circuit of the impedance measurement circuit 300, and no morespecial limitation here.

In some embodiments, the operation circuit 304 incudes the edge sampler305 and the accumulator 306. The edge sampler 305 is electricallyconnected to the VCO 309. The accumulator 306 is electrically connectedto the edge sampler 305 and other peripheral circuits (e.g., digitalsignal processor, hereinafter “DSP”); however, the disclosure is notlimited thereto.

The edge sampler 305 is able to receive the oscillation signal S1 fromthe VCO 309 and is able to generate the sampled signal S2 based on thesampling clock signal SCK. Furthermore, the edge sampler 305 is used toperiodically sense the power voltage VP on the power rail 301. Theaccumulator 306 is used to receive the sampled signal S2 from the edgesampler 305 and generate the measurement result based on the samplingclock signal SCK. It is to be noted that, the edge sampler 305 and theaccumulator 306 are integrated and unified to the first delay circuit307. Consequently, both of the edge sampler 305 and the accumulator 306are operated based on the same sampling clock signal SCK. Thereafter, atotal timing constraint (e.g., a total timing budget) of the impedancemeasurement circuit 300 is able to be relaxed.

In additional, in presented embodiment, the VCO 309 in the impedancemeasurement circuit 300 may be a ring oscillator circuit. In anotherembodiment, the VCO 309 may be any type of voltage control oscillationcircuit well known by a person skilled in this art.

FIG. 3B illustrates an exemplary equivalent circuit diagram of the edgesampler 305 of FIG. 3A in accordance with some other embodiments of thedisclosure. Referring to FIG. 3B, the edge sampler 305 of the impedancemeasurement circuit 300 includes a first flip-flop FF1, a secondflip-flop FF2, a delay buffer 313, and an XOR gate 314. The firstflip-flop FF1 and the second flip-flop FF2 may be D flip-flops but notlimit thereto.

According to the embodiments of this invention, the first flip-flop FF1includes a clock end CK, a data end D, and an output end Q. Similarly,the second flip-flop FF2 includes a clock end CK, a data end D, and anoutput end Q. The data end D of the first flip-flop FF1 receives theoscillation signal S1 from the VCO 309, the clock end CK of the firstflip-flop FF1 receives the sampling clock signal SCK, and the output endQ of the first flip-flop FF1 transmits a first signal S5 to the XOR gate314. The clock end CK of the second flip-flop FF2 receives a delayedsampling clock signal S4 from the delay buffer 313, the data end D ofthe second flip-flop FF2 receives the oscillation signal S1 from the VCO309, and the output end Q of the second flip-flop FF2 transmits a secondsignal S6 to the XOR gate 314. The delay buffer 313, electricallyconnected to the second flip-flop FF2, is used to apply a timing delayto the sampling clock signal SCK, generates and transmits the delayedsampling clock signal S4 to the clock end CK of the second flip-flopFF2. The XOR gate 314, electrically connected to the output end Q of thefirst flip-flop FF1 and the output end Q of the second flip-flop FF2, isused to receive the first signal S5 from the output end Q of the firstflip-flop FF1 and the second signal S6 from the output end Q of thesecond flip-flop FF2. Accordingly, the XOR gate 314 is used to performan XOR logic operation on the first signal S5 from the output end Q ofthe first flip-flop FF1 and the second signal S6 from the output end Qof the second flip-flop FF2 and thus to generate the sampled signal S2to be an XOR operation result.

The XOR gate 314 is used to receive the first signal S5 and the secondsignal S6 and performs an XOR logic operation on the first signal S5 andthe second signal S6 to generate the sampled signal S2.

In detail operation, the first flip-flop FF1 is used to sampleoscillation signal S1 according to the sampling clock signal SCK togenerate the first signal S5. The second flip-flop FF2 is used to sampleoscillation signal S1 according to the delayed sampling clock signal S4to generate the second signal S6. The XOR gate 314 generates the sampledsignal S2 by comparing the first signal S5 and the second signal S6.

FIG. 3C illustrates an exemplary equivalent circuit diagram of theaccumulator 306 in accordance with some other embodiments of thedisclosure. Referring to FIG. 3C, the accumulator 306 of the impedancemeasurement circuit 300 includes an adder 315 and a register REG. Theadder 315 is electrically connected to the register REG.

According to the embodiments of this invention, the adder 315 has afirst input end 316 and a second input end 317. The first input end 316of the adder 315 is able to receive the sampled signal S2, the secondinput end 317 of the adder 315 is able to receive a feedback signal S8,and an output end of the adder 315 is able to generate a first operationsignal S7. The register REG has the clock end CK, an input end IN, andan output end OUT. The clock end CK is able to receive the samplingclock signal SCK, the input end IN is able to receive the firstoperation signal S7, and the output end is able to generate themeasurement result. In some embodiments, the register REG provides themeasurement result to be the feedback signal S8.

The register REG of the accumulator 306 is used to temporarily store theoperation result generated by the adder 315. The adder 315 may performaccumulating operation by adding the temporarily stored operation resultwith the feedback signal S8.

FIG. 3D is a timing diagram of signal sampling and triggering 303illustrating the time-domain sensing of FIG. 3A in accordance with someother embodiments of the disclosure. Referring to FIG. 3D, the powervoltage VP is varied over time according to the delayed clock signal S3.The sampling clock signal SCK which is a periodical signal istransmitted to the edge sampler 305, the accumulator 306, and the firstdelay circuit 307. The sampling clock signal SCK has a period T.Accordingly, the operation circuit 304 is used to sense the powervoltage VP and generate the measurement result of the power impedancecircuit 300 based on the sampling clock signal SCK. Further, the firstdelay circuit 307 is used to generate the delayed clock signal S3 as thetrigger signal of the current source 308 associated the receivedsampling clock signal SCK. In some embodiments, a timing of the delayedclock signal S3 lags behind the sampling clock signal SCK with a firstdelay time τ1. In FIG. 3D, the delayed clock signal S3 may have aplurality of waveforms with different delay amounts. In here, thewaveform W1 has less delay amount τ1 than delay amount τ2 of thewaveform W2. Further, as a delay time of the delayed clock signal S3increases over time (e.g., from the first delay time τ1 to the seconddelay time τ2), the current source 308 sinks a current from the powervoltage VP over time as well. Thus the operation circuit 304 can sense acomplete signal of the power voltage VP of the PDN circuit 201 duringthe period T and generate the measurement result of the power impedancecircuit 300. In some embodiments, the delay amount may be a fixed timeinterval or a variable time interval.

FIG. 4 illustrates an exemplary equivalent circuit diagram of a portionof impedance measurement circuit 400 in accordance with some embodimentsof the present disclosure. Referring to FIG. 4 , the impedancemeasurement circuit 400 includes a VCO 403, a first edge sampler 401, asecond edge sampler 402, an operation circuit 404 and an accumulator405. The VCO 403 is electrically connected to the first edge sampler 401and the second edge sampler 402. The first edge sampler 401 and thesecond edge sampler 402 are electrically connected to the operationcircuit 404 and the VCO 403. The accumulator 405 is electricallyconnected to the operation circuit 404. The accumulator 405 is alsoconnected to a current sink, and the current sink is used to sink acurrent from a power rail. The power rail is used to transmit a powervoltage VP.

According to the embodiments of this invention, the VCO 403 is used tosense the power voltage VP on the power rail to generate the oscillationsignal S41. The VCO 403 is used to transmit the oscillation signal S41to the first edge sampler 401 and the second edge sampler 402. The firstedge sampler 401 receives the oscillation signal S41 from the VCO 403and samples the oscillation signal S41 to provide a first sampled signalS42 based on the sampling clock signal SCK. Similarly, the second edgesampler 402 is used to receive the oscillation signal S41 from the sameVCO 403 and sample the oscillation signal S41 to provide a secondsampled signal S43 to the operation circuit 404 based on a delayedsampling clock signal DSCK. In some embodiments, the first edge sampler401 and the second edge sampler 402 are able to sample a serial bitstream signal in a signal transition process for synchronization. Inthis embodiment, the impedance measurement circuit 400 is configured forfrequency domain sensing.

According to the embodiments of this invention, the delayed samplingclock signal DSCK is generated by delaying the sampling clock signal SCKby a delayed amount. In certain embodiments, the delayed amount may beincreased in a time sequence. In certain embodiments, the delay amountequals to an initial delay time plus an increasing value. In certainembodiments, the increasing value may be a variable value. In certainembodiments, the initial delay time is a non-negative value in atime-domain sensing scheme. In certain embodiments, the initial delaytime is 10˜100 times larger than that of a period of the oscillationsignal S41. In certain embodiments, the increasing value is N times aleast significant bit (LSB) of a period of the sampling clock signal,wherein N is a non-negative integer.

Based on above, in presented embodiment, merely one VCO 403 is needed.

In certain embodiments, the operation circuit 404 receives the firstsampled signal S42 and the second sampled signal S43, and generates anoperation result S44. Specifically, the operation circuit 404 mayperform an exclusive-or (XOR) operation on the first sampled signal S42and the second sampled signal S43 to generate the operation result S44.In detail, the operation circuit 404 compares the first sampled signalS42 and the second sampled signal S43 to generate the operation resultS44.

The accumulator 405 is able to receive the operation result S44 from theoperation circuit 404 and execute the accumulation operation to generatethe measurement result. The current sink is able to receive a delayedoutput signal from the first delay circuit and generate the powervoltage VP.

In certain embodiments, the VCO 403 is used to sense the power voltageVP from the power rail to generate the oscillation signal S41. The firstedge sampler 401 samples the oscillation signal S41 to generate thefirst sampled signal S42 based on the sampling clock signal SCK. Thesecond edge sampler 402 samples the oscillation signal S41 to generatethe second sampled signal S43 based on the delayed sampling clock signalDSCK. The sampling clock signal SCK is delayed by the delayed amount togenerate the delayed sampling clock signal DSCK, wherein the delayedamount may be increased in a time sequence. The operation circuit 404generates the operation result S44 according to the first sampled signalS42 and the second sampled signal S43 by the logical operation. Theaccumulator 405 is used to accumulate the first sampled signal S42 orthe operation result S43 to generate the measurement result. The currentsink is able to sink the current from the power rail according to adelayed output signal from a delay circuit or a selected signal selectedby a selector.

FIG. 5A illustrates an exemplary equivalent circuit diagram of adual-mode impedance measurement circuit in accordance with someembodiments of the present disclosure. A dual-mode impedance measurementcircuit 500 is configured to both execute time-domain andfrequency-domain sensing in one system, thus the dual-mode impedancemeasurement circuit 500 is able to provide the flexibility and reducingthe redundancy.

Referring to FIG. 5A, the impedance measurement circuit 500 includes theVCO 503, the first edge sampler 501, a second edge sampler 502, theoperation circuit 504, the accumulator 505, a current sink 506, a firstdelay circuit 507, a first selector 508, a second selector 511, anoscillator 512, a random number generator 513, a third selector 514, anda divider 515. The first delay circuit 507, which includes a seconddelay circuit 509 and a delay line 510, is electrically connected to thedivider 515, the first edge sampler 501, the second edge sampler 502,and the second selector 511. The first delay circuit 507 is used toreceive the sampling clock signal SCK from the divider 515 and is usedto generate and transmit a delayed output signal S51 based on a clocksignal CLK to the second edge sampler 502 and the second selector 511.Further, the first delay circuit 507 is used to delay the clock signalCLK for generating a delayed output signal S51. The second delay circuit509 of the first delay circuit 507 is electrically connected to thedivider 515 and the delay line 510. Further, the second delay circuit509 receives the sampling clock signal SCK and transmits a delayedsampling signal SD to the delay line 510 based on the clock signal CLK.In certain embodiments, the second delay circuit 509 could be a digitaldelay circuit. The delay line 510 of the first delay circuit 507 iselectrically connected to the second delay circuit 509, the second edgesampler 502 and the second selector 511. Further, the delay line 510receives the delayed sampling signal SD, generates the delayed outputsignal S51 and transmits the delayed output signal S51 to the secondedge sampler 502 and the current sink 506. In certain embodiments, thedelay line 510 could be a digital-controlled delay line (DCDL). In someembodiments, the delay line 510 may include multiple delay cells thatsubsequently delay the delayed sampling signal SD.

According to the embodiments of this invention, the first delay circuit507 is used to be a delay counter which provides the total delay byvirtue of counting the number of the clock period. In some embodiments,a total delay of the first delay circuit 507 is equal to the digitaldelay of the second delay circuit 509 plus the DCDL delay of the delayline 510. In some embodiments, the first delay circuit 507 has fasttuning capability under limiting phase noise. In one embodiment, thesecond delay circuit 509 is used to provide the coarse tuning digitaldelay and the delay line 510 is used to provide the fine tuning DCDLdelay. The second delay circuit 509 provides the majority of the totaldelay of the first delay circuit 507 thus reducing tuning time of thetotal delay of the first delay circuit 507. In some embodiments, thedelay line 510 is used to limit the tuning time sensitivity of the totaldelay of the first delay circuit 507. In some embodiments, the firstdelay circuit 507 is a hybrid delay generation scheme for reducing totalarea cost of the impedance measurement circuit 500.

The first selector 508 is electrically connected to the first edgesampler 501, the logic operation circuit 504, and the accumulator 505.Thus the first selector 508 is able to transmit a first selected signalS52 to the accumulator 505 according to a mode signal MODE. In someembodiments, the mode signal MODE is used to indicate that the impedancemeasurement circuit 500 is performed in a time domain sensing scheme ora frequency domain sensing scheme. In this embodiment, when the modesignal MODE is at a first logic level (i.e., MODE=0), the measurementcircuit 500 is performed in the time domain sensing scheme, and when themode signal MODE is at a second logic level (i.e., MODE=1) themeasurement circuit 500 is performed in the frequency time domainsensing scheme. The second selector 511 is electrically connected to thefirst selector and the delay line 510 of the first delay circuit 507. Asa consequence, the second selector 511 is able to receive the delayedoutput signal S51 generated by the delay line 510 and receive a thirdselected signal S54 outputted by the third selector 514, and is able tooutput one of the delayed output signal S51 and the third selectedsignal S54 as a second selected signal S3 to the current sink 506. Thethird selector 514 is electrically connected to the oscillator 512, therandom number generator 513, and the second selector 511. Consequently,the third selector 514 is able to transmit the third selected signal S54to the second selector 511 by selecting one of an emulated clock signalS55 of the oscillator 512 and a sequence number S56 generated by therandom number generator 513.

The oscillator 512 is electrically connected to the random numbergenerator 513 and the third selector 514. As a result, the oscillator512 is able to transmit the emulated clock signal S55 to the randomnumber generator 513 and the third selector 514. According to theembodiments of this invention, the oscillator 512, which is able togenerate a periodical and synchronic signal, could be a clockingdigital-controlled oscillator (DCO) that may be used as base clock inputfor next stage components. The clocking DCO is a well-known technique,and details thereof are not repeated herein. The random number generator513 is electrically connected to the oscillator 512 and the thirdselector 514. Thus the random number generator 513 is able to receivethe emulated clock signal S55 from the oscillator 512 and to generatethe sequence number S56. The random number generator 513, which could bea pseudo random bit sequences (PRBS) generator, is commonly used in adata transceiver as a source for testing input signals. In someembodiments, the combination of the oscillator 512, the random numbergenerator 513, and the third selector 514 could be used as device undertest (DUT), and could be used to simulate the actual load of thedual-mode power measurement system 500.

The divider 515 is electrically connected to the second delay circuit509 of the first delay circuit 507, the first edge sampler 501, and theaccumulator 505. Further, the divider 515 is able to generate thesampling clock signal SCK by virtue of dividing the clock signal CLKaccording to a dividing number N. In certain embodiments, the divider515 could be a programmable frequency divider which is generally appliedto the frequency synthesizer, a multimode frequency divider and a clockgenerator, etc. In certain embodiments, the divider 515 is able toreceive a high frequency signal generated by an oscillator, andgenerates a frequency-divided frequency to a counter (e.g., the firstdelay circuit 507) according to a dividing number N. In light of this,the counter counts the frequency-divided frequency to generate acorresponded output signal (e.g., the delayed output signal S51).

The first edge sampler 501 is electrically connected to the VCO 503, thesecond edge sampler 502, the first selector 508, the second selector511, the divider 515, and the operation circuit 504. In addition, thefirst edge sampler 501 is able to receive the oscillation signal S57generated by the ring oscillator circuit 516 from the VCO 503 and totransmit the first sampled signal S581 to the first selector 508 and theoperation circuit 504 based on the sampling clock signal SCK from thedivider 515. Similarly, the second edge sampler 502 is electricallyconnected to the VCO 503, the first edge sampler 501, the delay line510, the second delay circuit 509, the accumulator 505, and theoperation circuit 504. In addition, the second edge sampler 502 is ableto receive the oscillation signal S57 from the VCO 503 and to transmitthe second sampled signal S582 to the operation circuit 504 based on thedelayed output signal S51.

In certain embodiments, the first selector 508 executes the time-domainwaveform capturing and the frequency-domain waveform capturing whenreceiving the mode signal MODE at different logic level in the dual-modeimpedance measurement circuit 500. Specifically, the first selector 508is able to output the first selected signal S52 to the accumulator 505by selecting one of the first sampled signal S581 from the first edgesampler 501 and the operation result S59 according to the logicoperation executed by the operation circuit 504. As a consequence, theaccumulator 505 is able to output the time-domain or thefrequency-domain measurement result to the peripheral circuits.Specifically, the accumulator 505 is able to accumulate the firstsampled signal S581 or the operation result S59 to generate themeasurement result according to the mode signal MODE.

A step of accumulating the first sampled signal S581 or the operationresult S59 by the accumulator 505 to generate the measurement resultincludes accumulating the first sampled signal S581 or the operationresult S59 to generate the measurement result according to the modesignal MODE.

The VCO 516 is able to sense the power difference of the internal powersource VDDS and the internal ground source VSSS on the power rail. Incontrast, the current sink 506 is able to sink the power difference ofthe internal power source VDDS and the internal ground source VSSS onthe power rail according to the second selected signal S53 outputtedfrom the second selector 511 by selecting one of the delayed outputsignal S51 and the third selected signal S54. It is to be noted that,substantially, the VCO 516 and the current sink 506 are electricallyconnected to each other.

FIG. 5B is a timing diagram of the dual-mode impedance measurementcircuit of FIG. 5A in accordance with some other embodiments of thedisclosure. The horizontal axis refers to the time sequence with thetime unit in seconds.

Referring to FIG. 5B, the timing diagram is under the condition whereinthe mode signal MODE is at the first logic level (i.e., MODE=0) and thedividing number N is at six (i.e., N=6). As a result, the sampling clocksignal SCK is generated by dividing the clock signal CLK by 6. Thewaveform of the sampling clock signal SCK shows the result of executingdivide-by-six operation by the divider 614 (i.e., the sampling clocksignal SCK with one cycle). The delayed sampling signal SD can begenerated by delaying the sampling clock signal SCK according to acoarse-tuning delay t1. The second selected signal S53 is generated bydelaying the delayed sampling signal SD according to a fine-tuning delayis t2.

FIG. 5C illustrates an exemplary equivalent circuit diagram of thedual-mode impedance measurement circuit of FIG. 5A operated in atime-domain sensing scheme in accordance with some other embodiments ofthe disclosure. The dual mode impedance measurement circuit 500 is usedto perform a PDN impedance measurement by a time-domain sensing scheme.

Referring to FIG. 5C, during the time-domain sensing scheme, thecomponent with dotted lines means no action is being performed (i.e.,the second edge sampler 502, the operation circuit 504, the oscillator512, the random number generator 513, the third selector 514);therefore, the signals of the corresponding components are not beingtransmitted or generated as well. Herein, the first selector 508 outputsthe first selected signal S52 to the accumulator 505 when the modesignal MODE is directed to a time-domain sensing scheme. Further, thesecond selector 511 receives the delayed output signal S51 from thedelay line 510 and outputs the second selected signal S53 to the currentsink 506 when the mode signal MODE is at the first logic level (i.e.,MODE=0). It is to be noted that the delayed output signal S51 from thedelay line 510 is generated by delaying the delayed sampling signal SDfrom the second delay circuit 509. In certain embodiments, thetime-domain waveform sensing scheme is used to relax a timing marginwithout sacrificing power, area, and measuring time (i.e., thetime-domain sensing scheme for PDN impedance measurement is able toreduce area and power cost by avoiding additional compensations forrelaxing the timing margin, thus the circuit complexity is able to bedecreased).

The accumulator 505 is able to receive the first selected signal S52 andgenerate the measurement result based on the sampling clock signal SCKfrom the divider 515, wherein the divider 515 receives the dividingnumber N and generates the sampling clock signal SCK based on the clocksignal CLK.

Referring to FIG. 5C, the VCO 503 is able to sense the power voltage(e.g., the internal power source VDDS and the internal ground sourceVSSS) from the power rail to generate the oscillation signal S57 basedon the power voltage. The first edge sampler 501 is able to sample theoscillation signal S57 from the VCO 503 and to generate the firstsampled signal S581 to the first selector 508 based on the delayedoutput signal S51.

FIG. 5D illustrates an exemplary equivalent circuit diagram of thedual-mode impedance measurement circuit of FIG. 5A operated in afrequency-domain sensing scheme in accordance with some otherembodiments of the disclosure. The impedance measurement circuit 500 isused to perform the PDN impedance measurement by a frequency-domainsensing scheme.

During a frequency-domain sensing scheme, the component with dottedlines means no action is being performed; therefore, the signals of thecorresponding components are not being transmitted or generated as well.Herein, the first selector 508 outputs the first selected signal S52 tothe accumulator 505 when the mode signal MODE is directed to afrequency-domain sensing scheme. Further, the second selector 511outputs the second selected signal S53 to the current sink 506 when themode signal MODE is at the second logic level (i.e., MODE=1). It is tobe noted that the delayed output signal S51 from the delay line 510 isgenerated by delaying the delayed sampling signal SD from the seconddelay circuit 509.

Referring to FIG. 5D, the VCO 503 is able to sense the power voltage(e.g., the internal power source VDDS and the internal ground sourceVSSS) from the power rail to generate the oscillation signal S57 basedon the power voltage. The first edge sampler 501 is able to sample theoscillation signal S57 from the VCO 503 and to generate the firstsampled signal S581 to the operation circuit 504 based on the samplingclock signal SCK. The second edge sampler 502 is able to sample theoscillation signal S57 from the VCO 503 and to generate the secondsampled signal S582 to the operation circuit 504 based on the delayedoutput signal S51. As a result, the operation circuit 504 is able togenerate the operation result S59 based on the first sampled signal S581and the second sampled signal S582. In certain embodiments, thefrequency-domain spectrum capturing method for PDN impedance measurementis able to reduce the total area cost by virtue of reducing 50% area ofVCO 503.

Referring to FIG. 5D, the oscillator 511 is able to generate theemulated clock signal S55, the random number generator 513 is able togenerate the randomized sequence number S56, and the third selector 514is able to select the emulated clock signal S55 or the randomizedsequence number S56 to generate the third selected signal S54.

The accumulator 505 is able to receive the first selected signal S52 andgenerate the measurement result based on the sampling clock signal SCKfrom the divider 514, wherein the divider 514 receives the dividingnumber N and generates the sampling clock signal SCK based on the clocksignal CLK.

Please refer to FIG. 6 , which illustrates a flow chart for an impedancemeasurement method according to an embodiment of present disclosure. Ina step 601, a power voltage from a power rail is sensed to generate anoscillation signal based on the power voltage. In a step 602, theoscillation signal is sampled to generate a first sampled signal basedon a sampling clock signal. In a step 603, the oscillation signal issampled to generate a second sampled signal based on a delayed samplingclock signal, and in a step S604, the sampling clock signal is delayedby a delayed amount to generate the delayed sampling clock signal.Furthermore, in a step 605, the delayed amount can be increased in atime sequence. In a step 606, an operation result is generated accordingto the first sampled signal and the second sampled signal by a logicaloperation. In a step 607, the first sampled signal or the operationresult is accumulated to generate a measurement result. In a 608, acurrent is sunk from the power rail according to the delayed outputsignal or a third selected signal.

The implementation details of the above steps have been described indetail in the aforementioned examples and implementation methods and notto be restated here.

According to some embodiments of the present disclosure, an impedancemeasurement circuit includes a current source, coupled to a power rail;a voltage controlled oscillator (VCO), generating an oscillation signalaccording to a power voltage on the power rail; an operation circuit,coupled to the VCO, receiving a sampling clock signal and theoscillation signal, sensing the power voltage to generate a sampledsignal based on the sampling clock signal, and accumulating the sampledsignal to generate a measurement result; and a first delay circuit,coupled to the current source and the operation circuit, receiving thesampling clock signal and generating a delayed clock signal, wherein thefirst delay circuit transmits the delayed clock signal to the currentsource, and the current source sinks a current from the power railaccording to the delayed clock signal.

According to some embodiments of the present disclosure, an impedancemeasurement circuit, comprising: a voltage controlled oscillator (VCO),configured to sense a power voltage on a power rail to generate anoscillation signal according to the power voltage; a first edge sampler,coupled to the VCO, receiving the oscillation signal from the VCO, andsampling the oscillation signal to generate a first sampled signal basedon a sampling clock signal; a second edge sampler, coupled to the VCO,receiving the oscillation signal from the VCO, and sampling theoscillation signal to generate a second sampled signal based on adelayed sampling clock signal, wherein the delayed sampling clock signalis generated by delaying the sampling clock signal by a delayed amount,wherein the delayed amount is increased in a time sequence; an operationcircuit, coupled to the first edge sampler and the second edge sampler,receiving the first sampled signal and the second sampled signal, andgenerating an operation result; an accumulator, coupled to the operationcircuit, receiving the operation result from the operation circuit, andaccumulating the operation result to generate a measurement result; anda current sink, coupled to the power rail, receiving a delayed outputsignal and generating the power voltage.

According to some embodiments of the present disclosure, an impedancemeasurement method comprising: sensing a power voltage from a power railto generate an oscillation signal based on the power voltage; samplingthe oscillation signal to generate a first sampled signal based on asampling clock signal; sampling the oscillation signal to generate asecond sampled signal based on a delayed sampling clock signal; delayingthe sampling clock signal by a delayed amount to generate the delayedsampling clock signal; increasing the delayed amount in a time sequence;generating an operation result according to the first sampled signal andthe second sampled signal by a logical operation; accumulating the firstsampled signal or the operation result to generate a measurement result;and sinking a current from the power rail according to the delayedoutput signal or a third selected signal.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the disclosure.Those skilled in the art should appreciate that they may readily use thedisclosure as a basis for designing or modifying other processes andstructures for carrying out the same purposes and/or achieving the sameadvantages of the embodiments introduced herein. Those skilled in theart should also realize that such equivalent constructions do not departfrom the spirit and scope of the disclosure, and that they may makevarious changes, substitutions, and alterations herein without departingfrom the spirit and scope of the disclosure.

What is claimed is:
 1. An impedance measurement circuit, comprising: acurrent source, coupled to a power rail; a voltage controlled oscillator(VCO), configured to generate an oscillation signal according to a powervoltage on the power rail; an operation circuit, coupled to the VCO,configured to receive a sampling clock signal and the oscillationsignal, accumulate number of edges of the oscillation signal to generatea measurement result; and a first delay circuit, coupled to the currentsource and the operation circuit, configured to delay the sampling clocksignal to generate a delayed clock signal, wherein the first delaycircuit is configured to transmit the delayed clock signal to thecurrent source, and the current source is configured to draws a currentfrom the power rail to a ground operational based on the delayed clocksignal.
 2. The impedance measurement circuit of claim 1, wherein theoperation circuit comprises: an edge sampler, coupled to the VCO,receiving the oscillation signal, and generating the sampled signalbased on the sampling clock signal; and an accumulator, coupled to theedge sampler, accumulating the sampled signal to generate themeasurement result.
 3. The impedance measurement circuit of claim 2,wherein the edge sampler comprises: a first flip-flop, having a clockend, a data end, and an output end, wherein the data end of the firstflip-flop is configured to receive the oscillation signal, the clock endof the first flip-flop is configure to receive the sampling clocksignal, the output end of the first flip-flop is configured to generatea first signal; a second flip-flop, having a clock end, a data endcouple to the data end of the first flip-flop, and an output end,wherein the clock end of the second flip-flop is configured to receive adelayed sampling clock signal, the data end of the second flip-flop isconfigured to receive the oscillation signal, and the output end of thesecond flip-flop is configured to generate a second signal; a delaybuffer, configured to receive the sampling clock signal and generate thedelayed sampling clock signal; and an XOR gate, configured to receivethe first signal and the second signal, and output the sampled signal.4. The impedance measurement circuit of claim 2, wherein the accumulatorcomprises: an adder, having a first input end receiving the sampledsignal, a second input end receiving a feedback signal, and an outputend configured to generate a first operation signal; and a register,having a clock end receiving the sampling clock signal, an input endreceiving the first operation signal, and an output end configured togenerate the measurement result, wherein the register is configured toprovide the measurement result to be the feedback signal.
 5. Theimpedance measurement circuit of claim 1, wherein the edge sampler isconfigured to periodically sense the power voltage.
 6. An impedancemeasurement circuit, comprising: a voltage controlled oscillator (VCO),configured to sense a power voltage on a power rail to generate anoscillation signal according to the power voltage; a first edge sampler,coupled to the VCO, configured to receive the oscillation signal fromthe VCO, and sample the oscillation signal to generate a first sampledsignal based on a sampling clock signal; a second edge sampler, coupledto the VCO, configured to receive the oscillation signal from the VCO,and sample the oscillation signal to generate a second sampled signalbased on a delayed sampling clock signal, wherein the delayed samplingclock signal is generated by delaying the sampling clock signal by adelayed amount; an operation circuit, coupled to the first edge samplerand the second edge sampler, is configured to perform operation on thefirst sampled signal and the second sampled signal to generate an outputdata; an accumulator, coupled to the operation circuit, configured toreceive the output data from the operation circuit, and accumulate theoutput data to generate a measurement result.
 7. The impedancemeasurement circuit of claim 6, further comprising: a first delaycircuit, configured to receive the sampling clock signal, generate adelayed output signal based on the clock signal; a first selector,coupled to the first edge sampler, the logic operation circuit, and theaccumulator, configured to transmit a first selected signal to theaccumulator according to a mode signal.
 8. The impedance measurementcircuit of claim 7, wherein the first delay circuit further comprises: asecond delay circuit, configured to receive the sampling clock signal,generate a delayed sampling signal based on the clock signal; and adelay line, coupled to the second delay circuit and the second edgesampler, configured to receive the delayed sampling signal and transmitthe delayed output signal to the second edge sampler and the currentsink.
 9. The impedance measurement circuit of claim 7, furthercomprising: a second selector, coupled to the first selector and thefirst delay circuit, wherein the second selector is configured toreceive the delayed output signal and a third selected signal and outputone of the delayed output signal and the third selected signal to thecurrent sink.
 10. The impedance measurement circuit of claim 9, furthercomprising: an oscillator; a random number generator, coupled to theoscillator, configured to receive an emulated clock signal from theoscillator and generating a sequence number; and a third selector,coupled to the oscillator, random number generator, and the secondselector, configured to transmit the third selected signal to the secondselector by selecting one of the emulated clock signal of the oscillatorand the sequence number.
 11. The impedance measurement circuit of claim9, wherein the first selector is configured to output the first selectedsignal to the accumulator when the mode signal is directed to atime-domain sensing scheme, wherein the second selector outputs thesecond selected signal to the current sink when the mode signal is at afirst logic level.
 12. The impedance measurement circuit of claim 11,wherein the first selector is configured to output the first selectedsignal to the accumulator when the mode signal is directed to afrequency-domain sensing scheme, wherein the second selector isconfigured to output the second selected signal to the current sink whenthe mode signal is at a second logic level.
 13. The impedancemeasurement circuit of claim 6, further comprising: a divider, coupledto the first edge sampler and the accumulator, configured to divide aclock signal based on a dividing number to generate the sampling clocksignal.
 14. The impedance measurement circuit of claim 6, wherein theoperation circuit is configured to perform an exclusive-or operation onthe first sampled signal and the second sampled signal to generate theoutput data.
 15. The impedance measurement circuit of claim 6, whereinthe delay amount=an initial delay time+an increasing value, wherein theincreasing value is a variable value.
 16. The impedance measurementcircuit of claim 15, wherein the initial delay time is a non-negativevalue in a time-domain sensing scheme and wherein the initial delay timeis larger than 10˜100 times of a period of the oscillation signal in afrequency-domain sensing scheme.
 17. The impedance measurement circuitof claim 15, wherein the increasing value is N times a least significantbit (LSB) of a period of the sampling clock signal, wherein N is anon-negative integer.
 18. An impedance measurement method comprising:delaying a sampling clock signal by a delayed amount to generate adelayed sampling clock signal; sensing a power voltage on a power railto generate an oscillation signal; sampling the oscillation signal togenerate a first sampled signal based on a sampling clock signal;sampling the oscillation signal to generate a second sampled signalbased on the delayed sampling clock signal; generating an operation dataaccording to the first sampled signal and the second sampled signal by alogical operation; accumulating the first sampled signal or theoperation data to generate a measurement result; and drawing a currentfrom the power rail to a ground based on the delayed output signal or athird selected signal.
 19. The impedance measurement method of claim 18,wherein a step of accumulating the first sampled signal or the operationresult to generate the measurement result comprises: accumulating thefirst sampled signal or the operation data to generate the measurementresult according to a mode signal.
 20. The impedance measurement methodof claim 19, further comprising: generating an emulated clock signal;generating a randomized sequence number; and selecting the emulatedclock signal or the randomized sequence number to generate the thirdselected signal.